Parelec, Inc.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 186
 
  
 
C08K USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS 1101
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 150
 
  
 
G03G ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY 180
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 173

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
6379745 Low temperature method and compositions for producing electrical conductorsAug 20, 99Apr 30, 02[B05D, G03G, C08K]
6036889 Electrical conductors formed from mixtures of metal powders and metallo-organic decomposition compoundsMar 03, 98Mar 14, 00[C25D, H01B]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2007/0170,403 High conductivity inks with improved adhesionAbandonedMar 28, 07Jul 26, 07[H01B]
2007/0104,884 High conductivity inks with low minimum curing temperaturesAbandonedNov 27, 06May 10, 07[B05D]
7211205 High conductivity inks with improved adhesionExpiredJan 29, 03May 01, 07[H01B]
7141185 High conductivity inks with low minimum curing temperaturesExpiredJan 29, 03Nov 28, 06[H01B]
7115218 Low temperature method and composition for producing electrical conductorsExpiredJun 28, 01Oct 03, 06[H01B]
2006/0118,233 System and method for forming high resolution electronic circuits on a substrateAbandonedJan 05, 06Jun 08, 06[B27G, B32B]
7014727 Method of forming high resolution electronic circuits on a substrateExpiredJul 07, 03Mar 21, 06[B29C]
6824603 Composition and method for printing resistors, capacitors and inductorsExpiredOct 18, 02Nov 30, 04[C04B, C09D, H01C, H01G]
2004/0178,391 High conductivity inks with low minimum curing temperaturesAbandonedJan 26, 04Sep 16, 04[H01B]
6743319 Adhesiveless transfer lamination method and materials for producing electronic circuitsExpiredOct 04, 02Jun 01, 04[B05D, B65C, B32B, H05K]
6274412 Material and method for printing high conductivity electrical conductors and other components on thin film transistor arraysExpiredDec 21, 99Aug 14, 01[H01L, G01G]
6143356 Diffusion barrier and adhesive for PARMOD.TM. application to rigid printed wiring boardsExpiredAug 06, 99Nov 07, 00[B05D]

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